The MECHANIC XG-XGSP80 Lead-Free Soldering Paste is a premium-grade soldering solution designed for professional PCB repair, mobile phone servicing, and BGA rework. Formulated with Sn63/Pb37 alloy and rosin flux IPX3, it delivers excellent wetting, smooth joints, and strong adhesion on all types of circuit boards.

Its controlled viscosity and fine grain size (3# Microns) ensure consistent application and reliable soldering performance — even on small or delicate components. Perfect for SMD, SMT, and stencil-based reflow soldering tasks.

Features:

• Model: MECHANIC XG-XGSP80

• Alloy Composition: Sn63/Pb37

• Flux Type: Rosin flux IPX3

• Micron Size: 3# fine particles

• Weight: 60g

• Melting Point: 183°C

• Lead-Free and Eco-Friendly

• Smooth, consistent paste texture

• Strong bonding and high reliability

• Excellent for fine-pitch components

• Stable performance for BGA, SMD, and SMT soldering

 Applications:

• PCB circuit board repair

• BGA and SMT component soldering

• Mobile phone motherboard repair

• Electronic component rework and maintenance

• Reflow soldering with stencils

 Note:

• For professional use only

• Avoid inhalation or ingestion

• Store tightly closed in a cool, dry place

• Keep away from food and drinks

• Wash hands thoroughly after use

 Package Includes:
1 × MECHANIC XG-XGSP80 Soldering Paste (60g)