MECHANIC Soldering LW50 138 (50G) paste for mobile phone CPU repair reballing

The MECHANIC LW50 Solder Paste (50g, 138°C) is a low-temperature, high-performance soldering paste designed for mobile phone CPU repair, BGA reballing, and precision SMD rework. With its fast-melting, smooth-flow formula, it ensures strong chip bonding, stable conductivity, and clean solder joints — ideal for professional micro-soldering and rework applications.

Key Features

• Condition: 100% Brand New

• Brand: MECHANIC

• Model: LW50

• Type: Low Temperature Solder paste

• Weight: 50g

• Melting Point: 138°C

• Composition: High-purity tin alloy for strong and clean solder connections

• Function: Delivers smooth soldering performance, quick melting, and minimal oxidation

• Usage: Perfect for CPU repair, BGA reballing, smd soldering, and PCB repair work

• Performance: Fast melting, strong adhesion, and excellent thermal stability

Package Includes

• 1 × MECHANIC LW50 Low Temperature Solder Paste (50g, 138°C)